A summary of common basic knowledge in the adhesive industry (Ⅴ)

Bonding process (1)

1. Surface treatment (surface preparation): Chemical or physical treatment of the surface of the adherend to make it suitable for bonding or coating.

  2. Degrease: remove oil stains on the surface of adherends. Chemicals such as lye and organic solvents are usually used for treatment, and some also use equipment such as ultrasonic waves.

3. Abrading: Use sandpaper, wire brush or other tools to treat the surface of the adherend.

4. Sandblasting treatment: Use a sandblasting machine to eject high-speed sand flow to treat the surface of the adherend.

5. Chemical treatment: The adherend is placed in an acid or alkali solution to activate or passivate the surface.

6. Anodic oxidation: In order to protect the metal surface or make it suitable for bonding, the metal adherend is used as an anode and an oxide film is formed on the surface using electrochemical methods.

7. Spray coating: Use a glue gun to spray adhesive on the bonding surface of the adherend.

8. Glue amount (spread): The amount of adhesive applied to the unit bonding area of the adherend. Note: Single spread refers to the amount of adhesive applied to only one adherend of an adhesive joint.

9. Double spread: refers to the amount of adhesive applied to the two adherends of the adhesive joint.

10. Separate application method (separate application): When applying two-component adhesive, the two components are applied to the two adherends respectively, and the two components are superimposed together to form a bonding method.

11. Impregnation: A process in which the adherend is immersed in an adhesive solution or adhesive dispersion for coating.

12. Brush coating: A manual coating method that uses a brush to apply adhesive to the surface of the adherend. Suitable for adhesives whose solvent evaporates slowly.

13. Drying time: The time from glue application to adhesive drying under the specified temperature and pressure.

14. Drying temperature: The temperature required for the adhesive to dry after coating.

15. Slippage: During the bonding process, the adherends move relative to each other.

16. Positioning (fixing): fixing the adherend in an ideal position during gluing.

17. Open assembly time: The time from the time the surface of the adherend is coated with glue to the time it is exposed to the air before lamination.

18. Closed assembly time: the time after the glued surface is overlapped and before pressure is applied.

19. Assembly time: The time from when the adhesive is applied to the adherend to when the assembly is heated or pressurized, or both. Note: Assembly time is the sum of drying time and lamination time.

20. Laminating: A method or process of overlapping and pressing adhesive-coated substrates together.

21. Hot pressing: A bonding method that heats and pressurizes assembly parts.

22. Cold pressing: A bonding method that does not heat but only applies pressure to the assembly.